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Jan. 12, 2015

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Si2 InTheNews

Display News Articles:
2015-02-19 SI2’s Compact Model Coalition Releases New SPICE Model Standards for Fully Depleted Silicon- On-Insulator (FDSOI) MOSFET Technologies (PR)
2015-01-29 Si2’s Low Power Coalition Releases Common Power Format Standard Version 2.1 (PR)
2015-01-13 Si2 Aims to Boost Confidence in Designing 3D ICs (3DInCites)
2014-12-11 Spice Models Add Flavor to SOI (EE Times)
2014-10-22 Si2 to Sponsor “3D Architectures for Semiconductor Integration and Packaging Conference” (PR)
2014-10-10 Energy Boost For Power Standards (Semi Eng)
2014-10-01 TSMC Joins Si2’s Board of Directors
2014-08-13 3D IC Expands in New Dimensions at Si2 (PR)
2014-08-12 Si2 Names New Director of System-Level, Low Power Design (PR)
2014-07-02 OpenPDK accelerates design kit production at ST (Tech Design)
2014-06-02 Si2’s Low Power Coalition Releases Initial Specification Supporting Multi-Level Power Modeling (PR)
2014-05-29 MEDIA ALERT: Annual Si2 Open Reception at DAC
2014-05-28 Si2 MEDIA ALERT: 3D Panel at DAC – “Design for 3D: Are Standards Leading the Way or Lagging Behind?”
2014-05-27 Si2 Announces Release of OpenAccess Scripting Interface v3.0 (PR)
2014-05-23 Si2 Announces New Thermal Interface Protocol Standard for 3D Integrated Circuits (PR)
2014-05-22 Si2 Announces Board of Directors for 2014-2015 (PR)
2014-05-22 Si2 MEDIA ALERT: Press Conference with STMicroelectronics on Commitment to the Open Process Design Kit
2014-05-21 Si2 MEDIA ALERT: Presentation at DAC by Dr. Chenming Hu of University of California, Berkeley
2014-05-13 Si2 Announces Translator for the Open Process Specification into OpenAccess (PR)
2014-05-06 Si2 Announces Release of OpenAccess Polygon Operators Extension (PR)
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