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Multi-Die Packaging Gains Steam
Oct. 6, 2014

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  Si2 In the News (See More)
2014-10-22 Si2 to Sponsor “3D Architectures for Semiconductor Integration and Packaging Conference” (PR)
2014-10-10 Energy Boost For Power Standards (Semi Eng)
2014-10-01 TSMC Joins Si2’s Board of Directors
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LEF/DEF 5.8-p003 Spec and Parsers posted    Si2 Admin - 2014-10-22 10:30   [Lef/Def Exchange Format Ver5.8 and Above]
LEF/DEF 5.8-p003 have been released. This release is compatible with the OA 22.50 series.

oa22.43p036 posted    Si2 Admin - 2014-10-03 10:02   [OpenAccess Releases]
oa22.43p036, an Incremental Source Release, has been posted. This release is available to OAC members only.

OpenPDK PCell 1.0 Posted    Si2 Admin - 2014-10-01 12:53   [OPDKC Specifications]
OPDK PCell 1.0 has been posted for public downloads. This is the first version of OPDK PCell and is compatible with OPS 1.2. Distributions Includes: UML Model for PCell XSD Detailed DocFlex Documentation for the PCell XSD Examples

SPTAB OpenMatrices 1.0 Released   Susan Carver - 2014-09-26 10:02   [SPTAB Open Matrices]
The Si2 SPTAB OpenMatrices XSD standard describes the n-port scatter parameters (through the scattering matrix) for the linear frequency-domain behavior of optical devices, possibly for different operating points (temperature, voltage). This specification is available to any registered Si2 user.

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