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Standards and Beyond
Multi-Die Packaging Gains Steam
Oct. 6, 2014

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Event Date Location Activities WebSite and Information


November 02-06, 2014 Hilton San Jose, San Jose, CA
"Towards a Standard Flow for System Level Power Modeling"
ICCAD Web site

3D Architectures for Semiconductor Integration and Packaging Conference (3D ASIP)

December 10-12, 2014 Burlingame, CA
Keynote address, “A Design Ecosystem for Internet of Things, How 3D IC Standards will Enable a New Growth Paradigm.” Steve Schulz, Pres.&CEO, Si2
PRECONFERENCE SYMPOSIUM 2.5/3D-IC Design Tools and Flows, Jerry Frenkil, Si2
3D ASIP Conference Web Site
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