september 2007 newsletter

		*Innovation through Collaboration* September 2007 - Issue #9 Index (click to go directly to each section): 1. President's Letter 2. Si2 Corporate News 3. OpenAccess News 4. Open Modeling Coalition News 5. Low Power Coalition News 6. Design for Manufacturability Coalition News 7. Member Article - OCP-IP 8. Events As always, feel free to offer comments on the newsletter or to opt-out: Contact-Si2 Letter from the President In this article Steve Schulz, President and CEO of Si2, explains how Si2 operates and how we differ from other industry organizations. Click here.
		Si2 Corporate News *Si2 welcomes Jake Buurma*, a well-known face in the EDA industry. Jake joins Si2 as VP of West Coast Operations, giving our many west coast members a local point of contact. He will also serve as the key Si2 contact for the new Design for Manufacturability Coalition (see below). Jake has more than 33 years of industry experience equally split between the design of integrated circuits at major semiconductor companies such as National Semiconductor and Toshiba Semiconductor and developing EDA software at companies such as Cadence Design Systems, Silicon Navigator and Aprio. For more background information and contact information on Jake and other executive Si2 staff, follow this link: http://www.si2.org/?page=48
		OpenAccess News New Adoption Tools: Some new adoption tools have recently been contributed to the OpenAccess ecosystem. Si2Delta displays differences between the OA API doc files of different OA releases. This display enables quick identification of every detail that changed in the API documentation from one release to the next, wherever it occurs throughout the tree. This can help a programmer anticipate behavioral differences that might otherwise be overlooked. Si2 OA Tutorial is a PDF version of the popular Si2 OA Online Course. It is now packaged with all the exercises and labs. Though lacking many of the features of the Online version, it is a compact, portable solution to OA API training needs. More detials and links for both items can be found here: OpenAccess Contributions PCell Caching Mechanism: Another major contribution to the OpenAccess community has been made by Ciranova: the Ciranova PCell caching code and implementation for OpenAccess.There are two components in this contribution: a shared library and a standalone utility. Together they could provide an interoperable PCell caching mechanism that allows easy distribution of IP-free OA designs using proprietary PCells, without resorting to GDS or the like. Further information and links are located at this link. New Co-Chief Architect Elected: Jim Wilmore of Intel has just been elected as Co-Chief Architect for the OpenAccess Change Team. For Jim's biographical information, click here. The Change Team manages the evolution of the Open Access Information Model, API, and accompanying reference implementation. It is made up of representatives of twelve elected member companies with two year staggered terms and is guided by two chief architects from different industry segments. The Change Team manages the OpenAccess development and release roadmap and all contributions that make up the rich set of functionality that is OpenAccess. Open Modeling Coalition News The Open Modeling Coalition (OMC) is making steady progress on both the static and dynamic modeling approaches. On the static side, S-ECSM has now been approved as an Si2 standard. On the dynamic side, work continues beyond what was demonstrated at DAC 2007 on further development of the Joint Data Model (JDM) interface linking a client application like a timer running on OpenAccess with a delay calculator working off the IEEE1481 API. Results of this work will be presented and shown at the upcoming OpenAccess Conference on November 5, 2007. For further details, click here. Low Power Coalition News The Low Power Coalition is moving forward on 3 fronts. The Data Model and API working group is creating a better and more complete representation of the data and control for power information as seen by the tools that use this information. The Flows working group is developing a reference flow that can be used as a baseline template for power-aware design. The newest of the working groups, the Format Requirements working group, is chartered to define the requirements for necessary refinements of CPF as it exists today and for further enhancements to CPF to support the needs of power-aware design flows beyond what is currently supported. The Comparison WG initiated under the LPC was formed to evaluate, compare and contrast UPF and CPF from a technical perspective. With the results of this WG complete and posted on the Si2 website, the WG has been disbanded. Si2 thanks all those who made this essential output available to our industry. To see the results click here. DFMC News The biggest news is that the DTMC is now entering a new phase of effort and has been renamed the Design for Manufacturability Coalition (DFMC) to reflect its new focus. The founding members have recently been announced, see this link. In the meantime, the DFMC members have been working together to develop a DFM Dictionary. One of the well-known problems in discussing DFM problems has been alternative definitions of key terms. The DFM Dictionary pulls together those key definitions based on contributions from member companies. Until the DFMC considers the DFM Dictionary "complete" it is available only to DFMC members, but the following link describes recent entries and provides some sample sections. DFM Dictionary Member News Update: OCP-IP Among Si2's many corporate members, we also have cross-memberships with a number of industry organizations such as SEMI, edacentrum, and OCP-IP. We are pleased to provide them with this opportunity to communicate their activities. Click here for the OCP-IP Update Article. Events 11th OpenAccess+ Conference; November 5, Sun Microsystems, Santa Clara Click here for agenda and registration information. 3D Architectures for Semiconductor Integration and Packaging Conference: October 22 – 24, Hyatt Regency SF Airport, Burlingame, CA. Si2 is a co-sponsor of the 3-D Architectures for Semiconductor Integration and Packaging Conference,which will provide attendees and speakers the unique opportunity to explore and understand the technology and business implications of the trend toward 3-D device architectures in the semiconductor industry. Click here for more details.
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