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Si2 2012 Member Report
The Si2 2012 Member Report summarizes the year's accomplishments by Si2 initiatives including:
- OpenAccess Coalition (OAC)
- Design for Manufacturability Coalition (DFMC)
- Low Power Coalition (LPC)
- OpenPDK Coalition (OPDKC)
- Open3D TAB
- Silicon Photonics TAB (SPTAB)
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Lef/Def Exchange Format Version 5.8 2012-12-20
The Lef/Def Exchange Format Version 5.8 includes the Lef/Def 5.8 specification plus LEF/DEF reader/writer source. |
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OpenPDK Design Parameter & Callback Specification V1.0 2012-05-24
This initial release contains
- a pdf that helps to explain:
- the data used to define parameters
- the semantics of specifying callbacks
- the xsd, which is the normative specification for the parameter data
- a tar.gz containing xml examples that will parse against the xsd.
These examples are not meant to be realistic and are for format
illustration only.
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OPDKC Symbol Standard V1.0 2012-05-24
The OpenPDK Schematic Symbol Standard V1.0 consists of the following document and packages:
- OpenPDK Schematic Symbol Standard V1.0
- The normative XSD: si2_odpkSymbol_V1.0_2012-05-24.xsd
- The oPDK_Symbol_Std_V1.0_Reference_symbolLib_oa22_.tgz which is made up of the
Analog symbol library and the newly contributed SoringSoft source symbols library. The library
is in OpenAccess format.
- The OPDK_Symbol_Std_V1.0_Reference_SymbolLib catalog.tar.gz which contains the Reference XML
dumped from the Reference library using James Masters (Intel) Ruby Tools oa2xml and oa2svg. The catalog contains the reference XML for each of the 89 symbols in the reference library,
svg images for all symbols, and an overview with pin locations and symbol extents and instance boundary.
- A snapshot of an OA->XML translator, the contributed oaScript based RUBY TOOLS: OPDK_Symbol_STD_V1.0_Ruby_Tools_asof_052512.tar.gz
The XSD and pdf are available to non OPDKC member users. |
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3D Interconnect Architectures Glossary V1.0 24-Oct-2012
In order to come to a clear vision on roadmaps for 3D technologies, it is important to come to a clear definition
of what is understood by 3D interconnect technology and to propose a classification of the wide variety of
technologies. This definition should capture the functional requirements of 3D technology at the different
hierarchical levels of the system and correspond to the supply chain manufacturing capabilities.
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OPDKC OPS 1.0
The OPDKC Open Process Specification 1.0 (OPS) is targeted at Process producing companies (Foundries), to enable
study and creation of electronic versions of DRM, to gather early feed-back on completeness. OPS 1.0 includes XSDs, Docs, Examples, and Testcases. |
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Cadence Multi Pattern Technology - OpenAccess Extensions 2012-11-09
This Cadence contribution includes OpenAccess extensions which enable physical design tools to represent MPT information. The extensions support assigning mask "colors" to shapes and vias. To enable different instances of a design to be colored differently, the color of the shapes in an oaInst can be shifted on a per-layer basis. The extensions are for use with oa22.43 or later. Downloads require a user account. |
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oaScript Extension Language Bindings for OpenAccess 2012-11-29
The oaScript Work Group continues work on the new OpenAccess extension bindings for the scripting languages: Tcl, Ruby,Perl and Python. Latest releases include binaries for multiple versions of the scripting languages and latest releases of OpenAccess including oa22.43.
Downloads of the current releases are available to OpenAccess Coalition members.
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Value of Si2 and Consortia, Mark Mason, TI
Wonderful insights into the value of consortia and Si2 in particular by Mark Mason of TI. (Flash presentation) |
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Nangate FreePDK45 Generic Open Cell Library
The Nangate Open Cell Library is a generic open-source, standard-cell library provided for the purposes of research, testing, and exploring EDA flows. This library is purposely non-manufacturable. |
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Common Power Format (CPF) Version 2.0
The Common Power Format (CPF) Version 2.0 incorporates major enhancements to the widely adopted low-power intent format. Guided by the Si2 Interoperability Guide for Power Format Standards of 2010, CPF 2.0 includes features to improve interoperability with IEEE 1801-2009.
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OpenDFM 1.1 Physical Verification Specification
The work of the DFMC, the OpenDFM 1.1 standard is an open, high-level DRC language that can generate popular verification languages with no loss of accuracy or performance.
OpenDFM 2.0 is due out in Q1 2013. |
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Developing Vision for RLC Parasitics Framework in OpenAccess by Martin Foltin, HP
Martin Foltin\'s presentation from the Si2/OpenAccess+ Congference walks through the possibilities for an RLC Parasisitics Framework in OpenAccess. |
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Si2 High Level Power Modeling Requirements
Produced by the LPC Modeling Work Group, the Si2 High Level Power Modeling Requirements specification contains requirements for accurately and efficiently describing the power behavior of arbitrarily complex functions and is organized with one section for each independent requirement. Version 1.3 May 30 2012 is available. (Download requires a login) |
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Si2 Interoperability Guide for Power Format Standards
The guide documents a mapping between the subset of commands and arguments in 1801 and CPF that can be used to describe a low power design with consistent semantics to drive verification and implementation. |
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Statistical Methods For Semiconductor Chip Design
Developed by the Si2 Open Modeling Coalition
Statistical Working Group, this document addresses the
need, and intended usage, for statistical technics in design flows. |
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CPF 2.0, 1.1 and 1.0 Tutorials
In depth reviews of the versions of the CPF Standard. |
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OpenAccess Enables IBM Processor Design Success
Keith Barkley, of the Advanced Processor Design Systems and Technology Group at IBM, outlines the contribution of OpenAccess to their success.
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Liberty Extensions for Characterisation and Validation V1.0 Specification
Additional information recommended by the OMC for Liberty in order to establish a characterization environment, to validate models, and to correlate library models against SPICE simulation.(A user account is needed for download.) |
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Low Power Glossary 1.1
This collection of definitions has been produced by the LPC to enhance communication related to power-aware design and to promote industry-wide standardization. (Login is not required for this download.) |
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IEEE 1801 Isolation Location Discussion
Discussion of the isolation location from IEEE 1801.(Login is not required for this download.) |
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DFM Dictionary
The DFM Dictionary will cover the major factors for Process Limited Yield (PLY) which is the product of multiple yield limiters and the Circuit Limited Yield (CLY) which is the result of the widening variability of circuit parameters. (Login is not required for view.) |
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OpenAccess Tutorial and Labs
The OpenAccess API Tutorial, written by the Si2 staff, is 800+ pages and over 30 labs designed to teach a user the OpenAccess 2.2 API. (A user account is needed for downloads.) |
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Si2 Power Reduction Stimulus V1.0
Generated by the Low Power Coalition Format Working Group, the objective of this document is to identify and list all low power technologies used in minimizing power consumption in silicon and systems.(Login is not required for this download.) |
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CPF Parsers for versions 1.0. 1.1 and 2.0
This TCL-based parser is expected to allow CPF users to bring products to market more quickly that support CPF. (Requires an account and an easily submitted license.) |
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Si2 Power Closure Flow V1.0
Power Aware Flows and Design Techniques compiled by the Low Power Coalition Flow Work Group. (Login is not required for download) |
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