Building Successful OpenAccess Applications While Avoiding Bumps in the Road

DAC 2016

Description

The OpenAccess Database is the world’s most widely used, open reference database for IC design, with a supporting standard C++ API. It is superb for developing a stand-alone design tool and can also provide interoperability between EDA tools from different companies. The API is available in scripting languages through our extensions offering if C++ is more than you require. During this panel discussion, application developers using OpenAccess and OpenAccess extensions will describe their experiences along the way. The panel will be moderator by OpenAccess Coalition leadership.

What you will learn

  • The valuable role OpenAccess plays in the EDA world

  • Potential obstacles developers may encounter, and proven solutions

  • Helpful hints for OpenAccess developers

Panelists

  • * Moderator: Michaela Guiney, Product Engineering Director, Cadence Design Systems

  • Shiv Sikand, Executive Vice President of Engineering, IC Manage

  • Rudy Albachten, Principal Member of the Technical Staff, Intel

  • Brian Bradburn, Senior Director, Silvaco, Inc.

  • Ted Chou, Manager of Corporate Support, AnaGlobe Technology

  • Paul Clewes, Vice President, Research and Development, Pulsic

Building Successful OpenAccess Applications While Avoiding Bumps in the Road

Silicon Photonics Membership Agreement

The Silicon Photonics Coalition requires agreement to the following documents:

SP TAB Membership Agreement

sp_tab_membership_agreement
SP TAB Project Operating Rules

OpenPDK Membership Agreement

OpenPDK Membership requires the following documents:

 

OPEN PDK COALITION MEMBERSHIP AGREEMENT  – form and signature required.
OpenPDK Coalition Operating Rules  –  Review and understanding required

 

Si2 Low Power Membership Agreement

The Si2 LOW POWER COALITION  requires the following membership agreements:

First:  LOW POWER COALITION MEMBERSHIP AGREEMENT 01/2008

Second:  Low Power Coalition Operating Rules

CHIP – PACKAGE CO – DESIGN ( OPEN3D ) Membership Agreement

Membership in the Si2 Chip-Package Co-Design (aka (Open3D))  requires agreement to the following documents.

First:   CHIP-PACKAGE CO-DESIGN (OPEN3D)MEMBERSHIP AGREEMENT

dtmc__dfmc__agreement

Second:  DTMC__DFMC__Operating_Policy-1.pdf:  Attachment C- Project IP Policy

dtmc__dfmc__operating_policy

 

OpenDFM Membership Agreements

OpenDFM Membership Required Documennts

First:  SILICON INTEGRATION INITIATIVE, INC. DESIGN TO MANUFACTURING COALITION MEMBERSHIP AGREEMENT 01-20-2016

See below:

dtmc__dfmc__agreement

Second:  Design to Manufacturing Coalition Operating Policy 1.07.2007 (01-20-2016)

See below:

dtmc__dfmc__operating_policy

OpenAccess Membership Documents

OpenAccess Membership Required Documents

First: For access to current OpenAccess and oaScript (and other extensions) source code, the member must join the OpenAccess Coalition.

OpenAccess  Membership agreement:   OAC_Generic_Membership_Agreement.pdf  

oac_generic_membership_agreement

Second:   Use of OpenAccess requires the OpenAccess–Internal Use and Distribution License V 4.0 Oct. 1, 2004. 

openaccessinternaluseanddistributionlic_v4_041001

Third:   Use of Si2 OpenAccess Scripting Interface requires the ESG (Extensions Steering Group) OpenAccess ESG License v2.0 (January 31, 2013)

si2_esg_license_v2_0_01-31-2013