System level co-design of chip, package and PCB using native design databases in a unified 3D cockpit

Author:  James Church

Today’s advanced packaging design requires low layer count and high pin density to satisfy the cost pressures facing the electronics industry. By leveraging the native design formats, rules and technologies of each substrate designers can achieve a cohesive, optimized and properly constrained product.

Combining the OpenAccess IC layout database and Zuken’s own Package/PCB database format into a single hierarchically linked 3D system, enables system level optimization and visualization for a top-down or bottom-up flow that is not achievable in discrete point tools.

This paper was voted “Best Paper” by an audience survey taken after every presentation.

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Challenges and Opportunities in Global Standardization of Compact Models

DAC 2016

The Si2 Compact Model Coalition (CMC) is a collaborative industry-academia organization for creating standards for SPICE compact models. CMC standards drive innovation across the semiconductor foundry-fabless ecosystem by ensuring that well-vetted compact models and compact model interfaces are consistently implemented in vendor circuit simulators. This panel discusses developing cutting-edge models while simultaneously improving/maintaining legacy models and acting in the presence of a challenging model developer funding climate. Special focus is on models currently in the CMC pipeline including GaN, HEMTs (gallium nitride high-electron mobility transistors) and electrostatic discharge protection devices.

What you will learn

  • Advantages of using industry-wide compact model standards

  • New compact models in development and significant changes to legacy models

  • Challenges and solutions in evolving model language descriptions

  • How the CMC helps individual companies succeed and innovate

  • The status of R&D funding status and its impact on compact model development

Panelists

  • Moderator: John Ellis, President and CEO, Si2

  • Rob Jones, Senior Principal Engineer at Raytheon, Microelectronics Engineering & Technology Group, Raytheon

  • Marek Mierzwinski, Research and Development Engineer, Keysight Technologies

  • Josef Watts, Principal Member of the Technical Staff, GLOBALFOUNDRIES

  • Richard Williams, IBM

  • Peter Lee, Manager, Micron Technology

EDA Scripting Unleashed (Voted-Best-Paper)

Author:  James Masters, Intel

In many traditional design flows, high-performance robust EDA capabilities are limited to formal EDA tools. Design Automation (DA) engineers build additional project-specific capabilities either by using an EDA tool’s proprietary scripting API or by creating a standalone lightweight script that relies upon translation of design data into other formats. This results in extra runtime overhead, additional possible points of failure, and a burden of working with lossy design data formats.

With the advent of oaScript, DA engineers can quickly write scripts that directly read and write OpenAccess (OA) data using one of their favorite scripting languages – Perl, Python, Ruby, or Tcl. Also, a new OA extension is now available which provides high-speed layer manipulation and boolean operations directly within an oaScript – called “oaxPop” (OA eXtension Polygon Operators).

The combination of oaScript with oaxPop enables a DA engineer to write high-performance robust EDA capabilities without the overhead of using a formal EDA tool. This presentation will demonstrate how oaScript and oaxPop have been used together to create real-life applications that are used in a production design flow.

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BIO:

James Masterjames_master_1000x1000s graduated from the University of Phoenix with a Bachelor of Science in Information Technology with an emphasis on computer programming. He has worked at Intel Corporation for 20 years in various full-custom design implementation roles.

James is currently managing a team focused on improving custom layout productivity for Intel’s advanced process technologies. James is an advocate of open standards that help streamline the design flow and maximize productivity and reuse.

Outside of work James enjoys outdoor activities such as camping, fishing, hiking, gardening, etc.

Building Successful OpenAccess Applications While Avoiding Bumps in the Road

DAC 2016

Description

The OpenAccess Database is the world’s most widely used, open reference database for IC design, with a supporting standard C++ API. It is superb for developing a stand-alone design tool and can also provide interoperability between EDA tools from different companies. The API is available in scripting languages through our extensions offering if C++ is more than you require. During this panel discussion, application developers using OpenAccess and OpenAccess extensions will describe their experiences along the way. The panel will be moderator by OpenAccess Coalition leadership.

What you will learn

  • The valuable role OpenAccess plays in the EDA world

  • Potential obstacles developers may encounter, and proven solutions

  • Helpful hints for OpenAccess developers

Panelists

  • * Moderator: Michaela Guiney, Product Engineering Director, Cadence Design Systems

  • Shiv Sikand, Executive Vice President of Engineering, IC Manage

  • Rudy Albachten, Principal Member of the Technical Staff, Intel

  • Brian Bradburn, Senior Director, Silvaco, Inc.

  • Ted Chou, Manager of Corporate Support, AnaGlobe Technology

  • Paul Clewes, Vice President, Research and Development, Pulsic

Building Successful OpenAccess Applications While Avoiding Bumps in the Road

CHIP – PACKAGE CO – DESIGN ( OPEN3D ) Membership Agreement

Membership in the Si2 Chip-Package Co-Design (aka (Open3D))  requires agreement to the following documents.

First:   CHIP-PACKAGE CO-DESIGN (OPEN3D)MEMBERSHIP AGREEMENT

dtmc__dfmc__agreement

Second:  DTMC__DFMC__Operating_Policy-1.pdf:  Attachment C- Project IP Policy

dtmc__dfmc__operating_policy