Si2 oaScript Symposium: Scripting Made Easy

Si2 oaScript Symposium: Scripting Made Easy DAC 2017 Austin…
May 25, 2017/by tberke

System level co-design of chip, package and PCB using native design databases in a unified 3D cockpit

Author:  James Church Today's advanced packaging design…
May 4, 2017/by Barbara Pfeil

Challenges and Opportunities in Global Standardization of Compact Models

DAC 2016 The Si2 Compact Model Coalition (CMC) is a collaborative…
May 4, 2017/by Barbara Pfeil

EDA Scripting Unleashed (Voted-Best-Paper)

Author:  James Masters, Intel In many traditional design…
May 4, 2017/by Barbara Pfeil

Building Successful OpenAccess Applications While Avoiding Bumps in the Road

DAC 2016 Description The OpenAccess Database is the world’s…
May 4, 2017/by Barbara Pfeil

DAC 2016 Panel Discussion on DFM/DRC: The Insanity of DRC Rules and DFM and 10nm and Below

In just over 10 years, process nodes will have shrunk from 100nm…
May 2, 2017/by Barbara Pfeil

Chip/Package/Board Co-Design and Co-Analysis: Moving from Spreadsheets to EDA

DAC 2016: Description SoC development has become more…
May 2, 2017/by Barbara Pfeil

Tom Whipple Reelected Chair of Si2 Chip-Package Co-Design Group

Tom Whipple, solutions architect at Zuken, has been reelected…
April 19, 2017/by tberke

Si2 contributes advanced IC power modeling technology to IEEE.

- Si2 Contributes Advanced IC Power Modeling Technology to…
April 11, 2017/by tberke

What is Open about Si2 OpenAccess?

        By Marshall Tiner Director…
April 4, 2017/by tberke

Silicon Photonics Membership Agreement

The Silicon Photonics Coalition requires agreement to the following…
March 8, 2017/by Barbara Pfeil

OpenPDK Membership Agreement

OpenPDK Membership requires the following documents:   OPEN…
March 8, 2017/by Barbara Pfeil

Advanced Track Pattern Modeling in Si2 OpenAccess

JAMES D. MASTERS, senior CAD engineer at Intel, discusses…
March 8, 2017/by tberke

Si2 Low Power Membership Agreement

The Si2 LOW POWER COALITION  requires the following membership…
March 7, 2017/by Barbara Pfeil

CHIP – PACKAGE CO – DESIGN ( OPEN3D ) Membership Agreement

Membership in the Si2 Chip-Package Co-Design (aka (Open3D))  requires…
March 7, 2017/by Barbara Pfeil

OpenDFM Membership Agreements

OpenDFM Membership Required Documennts First:  SILICON INTEGRATION…
March 7, 2017/by Barbara Pfeil

OpenAccess Membership Documents

OpenAccess Membership Required Documents First: For access to…
March 7, 2017/by Barbara Pfeil

Paul Stabler New Chairman of Si2 OpenAccess Board

Paul Stabler, senior engineering manager in the IBM EDA organization,…
March 7, 2017/by tberke

Si2 Bylaws 27-Feb-2015

Si2 ByLaws 27-Feb-2015 Si2 ByLaws should be read by all Si2…
March 3, 2017/by Barbara Pfeil

Si2 Antitrust Guidelines V1.0

Si2 Antitrust Guidelines  Ver1.0 The Si2 Antitrust Guidelines…
March 3, 2017/by Barbara Pfeil

GaN HEMT SPICE Model Standard for Power and RF

Description: Si2's Compact Model Coalition is currently in…
March 3, 2017/by Barbara Pfeil

Nicolas Williams of Mentor Graphics Joins Si2 Standards-Setting Group

Nicolas Williams of Mentor Graphics has been elected to the Si2…
February 22, 2017/by tberke

Accelerating Analog Design and Migration at the Functional Level

DR. RAMY ISKANDER, CEO of Intento Design, discusses the use…
February 17, 2017/by tberke

Leveraging OpenAccess to Bridge Gaps in System Co-Design

HUMAIR MANDAVIA, chief strategy officer at Zuken, discusses…
February 17, 2017/by tberke

Si2 Special Interest Groups—Forums for Collaborative Problem Solving

          By Ted…
January 18, 2017/by tberke

CMC Q4 2016 Meeting Agenda

AGENDA
January 17, 2017/by John Ellis

Si2 Antitrust Guidelines

The Si2 Antitrust Guidelines are a fundamental part of our operation…
January 17, 2017/by John Ellis

Si2 University Partner Network Adds New Member

Jeshairaj Thakaria is the newest member of the Si2 University…
January 16, 2017/by tberke

What’s Hot and What’s Not in Low Power

December 13, 2016/by John Ellis

Welcome to our New Members

The Si2 staff and board of directors welcome our newest members: Si2…
December 7, 2016/by tberke

Geoffrey Coram Named New CMC Technical Advisor

Geoffrey J. Coram of Analog Devices is the new volunteer technical…
November 28, 2016/by tberke

Free Webinar for Si2 Members focuses on XML Schemas

Si2 announces the second in a series of member-only webinars…
October 21, 2016/by tberke

Free Webinar for Si2 Members: Introduction to XML

Many Si2 OpenStandards are based on XML, the eXtensible Markup…
August 25, 2016/by tberke

Matt Wheaton Joins Si2 for OpenAccess Support

Matthew Wheaton, a software engineering professional whose experience…
August 9, 2016/by tberke

Si2 Announces Board of Directors for 2016-2017

Si2 Members Meeting Set for Monday, June 6, at the Design Automation…
June 3, 2016/by tberke

Committee Corner: Aparna Dey, Cadence Design Systems

Recognizing Outstanding  Si2 Committee Volunteers   Aparna…
May 23, 2016/by tberke

Member Spotlight: PhoeniX Software

By Twan Korthorst Chief Executive Officer PhoeniX Software The…
May 23, 2016/by tberke

Si2 Launches Effort to Develop New Integrated Circuit Power Modeling Technology

AUSTIN, Texas--Silicon Integration Initiative (Si2), an Austin-based…
May 10, 2016/by tberke

Committee Corner: Gregory Schaeffer, IBM

As the co-chair of the Si2 OpenAccess Change Team, Gregory Schaeffer…
April 18, 2016/by tberke

Member Spotlight: ANSYS, Inc.

By Vic Kulkarni Senior Vice President and General Manager RTL…
April 14, 2016/by tberke

Design Agility: The Solution to EDA Commoditization

By Marshall Tiner Director, Production Standards In a recent…
April 14, 2016/by tberke

Plans Begin for PDK Special Interest Group

Si2 is planning to launch its first special interest group, which…
April 7, 2016/by tberke

What You Need to Know about R&D Joint Ventures

Si2 and other research and development joint ventures fill an…
February 26, 2016/by admin

OpenStandards: A New Initiative for R&D Collaboration

OpenStandards, Si2’s newest member initiative, is the product…
January 24, 2016/by admin