Entries by Terry Berke

Chip/Package/Board Co-Design and Co-Analysis: Moving from Spreadsheets to EDA

DAC 2016: Description SoC development has become more than just silicon design. Today, successful SoC design requires consideration of the electrical, thermal, and mechanical interactions of the chip, the package and the board. This is especially true for silicon-in-package designs and 3D designs such as Hybrid Memory Cubes and High Bandwidth Memories. Co-design of the […]

Tom Whipple Reelected Chair of Si2 Chip-Package Co-Design Group

Tom Whipple, solutions architect at Zuken, has been reelected chair of the Si2 Chip-Package Co-Design Technical Advisory Board. The TAB’s primary goal is to identify problems in chip-package-board design flows, and flows and data exchange solutions to solve them. At Zuken, Tom is responsible for defining, promoting and supporting chip-package-board co-design solutions using Zuken CR-8000 […]

Si2 contributes advanced IC power modeling technology to IEEE.

– Si2 Contributes Advanced IC Power Modeling Technology to IEEE Technology will improve SoC design for power efficiency – AUSTIN, Texas–Silicon Integration Initiative, Inc. (Si2), a leading integrated circuit research and development joint venture, has contributed new power modeling technology to the IEEE P2416 System Level Power Model Working Group. The transfer is aimed at […]