In just over 10 years, process nodes will have shrunk from 100nm in 2005 to 10nm in 2017. An upsurge in the complexity of advanced DRC decks makes it almost impossible to code rule decks using basic Pass/Fail DRC rules. The exponential increase in the design rule count and the number of operations required by […]
About Terry Berke
This author has yet to write their bio.Meanwhile lets just say that we are proud Terry Berke contributed a whooping 63 entries.
Entries by Terry Berke
DAC 2016: Description SoC development has become more than just silicon design. Today, successful SoC design requires consideration of the electrical, thermal, and mechanical interactions of the chip, the package and the board. This is especially true for silicon-in-package designs and 3D designs such as Hybrid Memory Cubes and High Bandwidth Memories. Co-design of the […]
Tom Whipple, solutions architect at Zuken, has been reelected chair of the Si2 Chip-Package Co-Design Technical Advisory Board. The TAB’s primary goal is to identify problems in chip-package-board design flows, and flows and data exchange solutions to solve them. At Zuken, Tom is responsible for defining, promoting and supporting chip-package-board co-design solutions using Zuken CR-8000 […]
– Si2 Contributes Advanced IC Power Modeling Technology to IEEE Technology will improve SoC design for power efficiency – AUSTIN, Texas–Silicon Integration Initiative, Inc. (Si2), a leading integrated circuit research and development joint venture, has contributed new power modeling technology to the IEEE P2416 System Level Power Model Working Group. The transfer is aimed at […]
The Silicon Photonics Coalition requires agreement to the following documents: SP TAB Membership Agreement SP TAB Project Operating Rules
OpenPDK Membership requires the following documents: OPEN PDK COALITION MEMBERSHIP AGREEMENT – form and signature required. OpenPDK Coalition Operating Rules – Review and understanding required
JAMES D. MASTERS, senior CAD engineer at Intel, discusses advanced track modeling in the Si2 OpenAccess database. Click here to see the video.
The Si2 LOW POWER COALITION requires the following membership agreements: First: LOW POWER COALITION MEMBERSHIP AGREEMENT 01/2008 Second: Low Power Coalition Operating Rules
Membership in the Si2 Chip-Package Co-Design (aka (Open3D)) requires agreement to the following documents. First: CHIP-PACKAGE CO-DESIGN (OPEN3D)MEMBERSHIP AGREEMENT Second: DTMC__DFMC__Operating_Policy-1.pdf: Attachment C- Project IP Policy
OpenDFM Membership Required Documennts First: SILICON INTEGRATION INITIATIVE, INC. DESIGN TO MANUFACTURING COALITION MEMBERSHIP AGREEMENT 01-20-2016 See below: Second: Design to Manufacturing Coalition Operating Policy 1.07.2007 (01-20-2016) See below: