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Si2 Round-Up at DAC -- Standards in Action
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Program
Goals:
Standards have been proven to reduce cost of
operations, drive greater process efficiencies and
offer greater opportunities for start-up companies
to infuse fresh technology in the design and
manufacturing of IC's. Si2 standards have been
targeted to resolve “pinch-points” in the overall
semiconductor supply chain with a steadfast focus
on rapid adoption of these standards. This
day-long program, consisting of 4 individual
events, will showcase activities currently
underway with an eye towards demonstrating the
value of these programs to the program
participants and to the overall semiconductor
industry. Therefore, this day-long session should
entice engineers and technologists working at both
current and cutting-edge technology nodes and also
managers responsible for driving both design and
manufacturing strategy, and related financial and
staffing decisions. A featured part of the program
will celebrate the 10th Anniversary of OpenAccess.
| 09:00am -
10:30am |
OPS Comes to
Life
The Open Process Specification (OPS)
standard, from Si2's OpenPDK Coalition,
contains all of the data elements that are
necessary to create a Process Design Kit
(PDK) in any EDA vendor's or company
proprietary design flow. This session is
designed to appeal to any engineer working
with PDKs and any engineering manager
making budgeting or ROI decisions
concerning PDK development. It will
describe the structure and organization of
this very important new standard in the
industry and examples of the use cases
that this standard will cover.
Presentations:
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| 10:45am -
12:15pm |
DRC+ - The
Next Frontier
DRC+ augments standard DRC by applying
fast 2D pattern matching to physical
verification to quickly identify
problematic 2D patterns called hotspots In
contrast to more time consuming
lithographic simulations used after
tapeout, DRC+ is transparent to designers
as part of their normal DRC checks and
it's fast enough to be inserted throughout
the entire design flow.
This award winning technology has been
contributed to Si2 and it forms the basis
for our next generation OpenDFM standard.
This session will cover process
characterization, pattern recognition and
physical verification using DRC+
acceleration that can be used by any DRC
engine.
Presentations:
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| 02:00pm -
03:00pm |
New Si2
Standards In Action On Real-World
Tools
This session will demonstrate the recently
published Si2 Open Process Design Kit
(OpenPDK) standards and Open Design for
Manufacturability (OpenDFM) standards
working with commercially available tools.
Si2 standards promote interoperability and
these demos are designed to illustrate
that point. The demos will show the
OpenPDK symbol standard validating the
correctness or incorrectness of a
schematic symbol change as compared to the
standard in real time. The OpenDFM
standard will demonstrate an integrated
physical verification flow from an
electronic Design Rule Manual (eDRM) to
XML, to OpenDFM and to four different DRC
engines.
DAC DEMO: OPDK Symbols
DAC DEMO: DRM to DRC
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| 03:15pm -
04:30pm |
Standards for
a 3D World
Si2 is focusing on developing design flow
standards, its area of expertise, to
support both 2.5D and 3D designs using
through silicon vias (TSV). Specific areas
being covered at this time include
standards for sharing constraints for
power distribution networks, thermal
constraints to define such things as
“keep-out areas” and constraints to import
IP (both dies and blocks) into pathfinding
and constraints out of pathfinding into
downstream design of individual dies,
stacks and interposers. To ensure
consistency in standards and to prevent
duplication, the Open3D TAB is connected
to other relevant groups to ensure a
complete solution.
So, this short session will include a
presentation of status of activities in
the TAB followed by a panel discussion
which will include industry experts who
will present some of the issues being
addressed now and also cover some of the
future challenges.
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| Low Power Session:
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Presentations
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