By Vic Kulkarni
Senior Vice President and General Manager
RTL Power Business
San Jose, Calif.
Innovation in semiconductor design is enabling smaller device architectures with higher performance and energy-efficient devices for powering smart products in the emerging Internet of Things verticals.
In addition to solving problems posed by the Moore’s Law, traditional EDA companies must address challenges in power noise integrity, electro-migration and thermal management in intelligent sensor systems containing 3-D stacked die structures, on-chip WiFi and Bluetooth radios, mixed-signal, IP encryption, complex CPU/APUs for edge nodes and providing analytics for chip-package-system designers.
ANSYS multi-physics simulation driven product design workbench provides complete virtual prototypes of complex products and systems–comprised of electronics, and mechanical, fluid and embedded software components– which incorporate all the physical phenomena that exist in real-world environments.